IPTEK The Journal of Engineering (p-ISSN: 2337-8557, e-ISSN:2807-5064) is an academic journal on the issues related to engineering and technology published by Pusat Publikasi Ilmiah, Institut Teknologi Sepuluh Nopember. IPTEK The Journal of Engineering published first time in August 2014, from 2014-2018 (Volume 1-4) published three issues annually, and 2019 published two issues annually. Since 2023 IPTEK The Journal of Engineering regularly published three issues annually in April, August, and December.

IPTEK The Journal of Engineering has been indexed by Google Scholar, GARUDA, and also has been accredited by SINTA 4.

IPTEK The Journal of Engineering is also collaborating with FPTVI LSP (Forum Perguruan Tinggi Vokasi Indonesia Asosiasi Lembaga Sertifikasi Profesi), MIA (Pusat Unggulan IPTEK Mechatronics and Industrial Automation), and APTIMOR (Aktor Penyedia Teknologi Industri Mekatronika, Otomasi dan Robotika) in terms of sharing knowledge in Journal Management and Publishing. 

It is open to all scientist, researchers, education practitioners, and other scholars. Therefore this journal welcomes various topics in different engineering disciplines. Our target is to reach all universities, research centers and institutes worldwide.

Call for Papers

IPTEK The Journal of Engineering is an open-access journal, which means that visitors all over the world could read, download, cite, and distribute papers published in this journal for free. We adopt a peer-review model, which insured fast publishing and convenient submission. In addition to peer-reviewed original research papers, the Editorial Board welcomes original research reports, state-of-the-art reviews and communications in the broadly defined field of engineering science and technology. Theses, dissertations, research papers, and reviews are all acceptable for publication.

All topics should relevant to the issues faced by industries, governments, and communities. The broad-based topics may be covered by the following knowledge areas:

Computer Engineering and Information Systems (Telematics, Algorithms and Programming, Network Based Computing, Smart Computing and Vision, Intelligent Information Management, Computer Architecture and Networking, Applied Modeling and Computing, Graphics Interaction and Games, Software engineering, Information Technology Infrastructure and Security, Information Systems Management, Data Engineering and Business Intelligence, Data Acquisition and Information Dissemination, Enterprise System, and Smart Cities and Cyber Security)

Civil Infrastructure Engineering (Hydrotechnics and Surveying, Construction Implementation Management, Building Materials and Structures, and Transportation and Geotechnics)

Mechanical Engineering (Energy Convertion, Metallurgical and Materials Engineering, Mechanical Design, and Manufacture)

Electrical Engineering Automation (Cyber Physical, Automation, and Industrial Robots, Programmable Logic Controller and Control System, Antennas and Propagation, Instrumentation, Measurement and Power System Identification, Multimedia Telecommunications Network, Multimedia Communication, Electric Energy Conversion, Electric Power System Simulation, High voltage, System and Cybernetics, Microelectronics and Embedded Systems, Biocybernetics, Instrumentation and Biomedical Signal Processing, Multimedia Computing and Machine Intelligence, and Digital Signal Processing)

Chemical Engineering (Applied Chemistry, Biochemical and Bioprocess, Advance Functional Materials and Analysis, Thermodynamic, Chemical Reaction, Material and Nanocomposite, Bioenergy, Wastewater Treatment, Process Integration, Fluid Mechanic, and Sustainable Industrial Systems)

Instrumentation Engineering (Control Instrumentation, Measurement Instrumentation, Photonic Engineering, Vibration and Acoustics, and Embedded Systems and Physical Cyber)

Business Statistics (Business Analytic, and Quality and Productivity Engineering)

And physical, chemical, biological, and environmental sciences that are directly related to engineering.

Please click here to submit your paper.